EPF10K200EBC600-2 vs EPF10K250EBC600-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-2 sa pamamagitan ng Intel at EPF10K250EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EBC600-2 EPF10K250EBC600-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX-10KE —
Logic Family CMOS (SRAM-based) —
Process Technology 0.30 µm CMOS SRAM-based CMOS
Typical Gate Count 200,000 gates —
Logic Elements (LEs) 9984 —
Logic Array Blocks (LABs) 1248 —
Embedded Memory (EAB) 98304 bits (96 Kbits) —
Maximum User I/O 470 pins 470
Propagation Delay 0.4 ns —
Volte ng Pagbibigay 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) —
I/O Standards LVTTL, LVCMOS, PCI, GTL+ —
Package Type 600-ball BGA (BGA-600) —
Package Dimensions 45 × 45 mm —
Ball Pitch 1.27 mm —
Package Height 1.1 mm max —
Temperature na Operasyon 0°C to +70°C (Commercial) [DATA_NEEDED: operating temperature range]
Uri ng Pagpapasok Surface Mount —
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM —
Part Status Obsolete —
Tindminan RoHS unknown —
Family — FLEX 10KE
Logic Elements — 12,160 LEs
Typical Gates — 250,000
Embedded Array Blocks (EABs) — 12 (each 2 Kbits)
Total Embedded Memory — 24 Kbits (RAM)
PLLs (Phase-Locked Loops) — 4
Dedicated Clock Inputs — 6
Speed Grade — -3
Core Supply Voltage — 3.3 V
I/O Supply Voltage — 3.3 V (5 V tolerant)
Packhaging — 600-ball FineLine BGA
Configuration Mode — Passive Serial / Passive Parallel / JTAG
Boundary Scan — IEEE 1149.1 (JTAG)

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