EPF10K200EBC600-3 vs EPF10K200EBC600-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-3 sa pamamagitan ng Intel at EPF10K200EBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-3 | EPF10K200EBC600-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | — |
| Speed Grade | -3 (commercial) | — |
| Packhaging | 600-ball FineLine BGA, 45 x 45 mm | 600-BGA |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0C to +70C (commercial) | — |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Volte ng Pagbibigay | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Propagation Delay | — | 0.4 ns |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |