EPF10K200EBI600-2 vs EPF10K200EBI600-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBI600-2 sa pamamagitan ng Intel at EPF10K200EBI600-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBI600-2 | EPF10K200EBI600-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | 9,984 |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | 12 |
| User I/O Pins | 470 | 470 |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns to 0.6 ns (per LE) |
| Temperature na Operasyon | 0 C to 70 C (commercial) | 0 °C to +70 °C (commercial) |
| Packhaging | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Logic Family | CMOS, SRAM-based | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| Tindminan RoHS | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Total RAM Bits | — | 98,304 |
| Dedicated Inputs | — | 6 |
| Technology / Process | — | 0.22 µm CMOS SRAM |
| Core Supply Voltage | — | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Maximum Internal Frequency | — | 200 MHz |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |