EPF10K200EFC672-3 vs EPF10K250EFC672-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-3 sa pamamagitan ng Intel at EPF10K250EFC672-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EFC672-3 EPF10K250EFC672-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX 10KE —
Number of Logic Elements / Cells 9,984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) —
Number of I/O 470 —
Number of Gates (typical) 200,000 —
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) —
Process Technology 0.22 µm CMOS —
Maximum Operating Frequency 166.67 MHz —
Propagation Delay 0.4 ns 0.4 ns
Packhaging / Kaso 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon 0 °C to +70 °C (commercial) 0C to +70C (Commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) —
Number of PLLs 4 —
Tindminan RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
Level ng MSL [DATA_NEEDED: MSL level] —
Lead-Free [DATA_NEEDED: lead-free status] —
Family — FLEX 10KE
Logic Family — CMOS
Typical System Gates — 250,000
Maximum User I/Os — 470
Total Pins — 672
Package Type — BGA-672
Package Size — 45 x 45 mm
Ball Pitch — 1.27 mm
Package Shape — Square
Terminal Form — Ball
Programming Technology — In-system, SRAM-based
Configuration Interface — Serial (passive/active)
Speed Grade — -1

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