EPF10K200SBC356-3 vs EPF10K200SBI356-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-3 sa pamamagitan ng Intel at EPF10K200SBI356-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SBC356-3 | EPF10K200SBI356-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10K | FLEX 10KS |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 24 (98,304 bits RAM) |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | — |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| Temperature na Operasyon | 0 C to 70 C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Packhaging | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-BGA (SB) 35×35 mm, 1.27 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 9,984 |
| System Gates | — | 200,000 |
| User I/O Pins | — | 274 |
| Core Voltage | — | 2.5 V |
| Speed Grade | — | -2 |
| Maximum User I/O | — | 274 |
| In-System Programmability | — | Yes (JTAG/ByteBlaster) |
| Configuration Method | — | SRAM-based, ISP |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |