EPF10K200SFC484-1 vs EPF10K130EFC484-3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFC484-1 sa pamamagitan ng Intel at EPF10K130EFC484-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SFC484-1 | EPF10K130EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10KS | — |
| Logic Cells | 9984 | — |
| System Gates | 200,000 | — |
| Embedded RAM Bits | 98,304 | — |
| Number of LABs/CLBs | 1248 | 832 |
| Number of Logic Elements | 9984 | — |
| Total RAM Bits | 98304 | 65536 |
| User I/O Count | 369 | — |
| Number of DLLs | 4 | — |
| Hanay ng Temperature na Operasyon | 0C to 70C (commercial) | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Internal Operating Frequency | 250 MHz | — |
| Packhaging | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | -1 (slowest of -1/-2/-3) | -3 (faster timing bin) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP | — |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |