EPF10K250EFC672-1 vs EPF10K250EFC672-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K250EFC672-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-1 EPF10K250EFC672-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 10KE FLEX 10KE
Logic Family CMOS CMOS, SRAM-based
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm —
Package Shape Square —
Terminal Form Ball —
Temperature na Operasyon 0C to +70C (Commercial) 0 C to +70 C (Commercial)
Propagation Delay 0.4 ns 0.4 ns
Programming Technology In-system, SRAM-based —
Tindminan RoHS [DATA_NEEDED: RoHS status] Non-RoHS Compliant (per Fly-Wing listing)
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Interface Serial (passive/active) —
Speed Grade -1 —
Logic Elements — 12,480
Typical Gates — 250,000
Embedded Array Blocks (EABs) — 20
Maximum User RAM Bits — 40,960
User I/Os — 470
Packhaging — 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch
Bilang ng Pin — 672
Core Supply Voltage — 2.3 V (typical 2.5 V)
I/O Standard Support — 1.8 V, 2.5 V, 3.3 V (multi-volt I/O)
Configuration — SRAM, in-system programmable (ISP) via JTAG
Boundary Scan — IEEE 1149.1 (JTAG) compliant

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