EPF10K250EFC672-3 vs EPF10K250EFC672-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-3 sa pamamagitan ng Intel at EPF10K250EFC672-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-3 EPF10K250EFC672-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Product Type FPGA (Field Programmable Gate Array) —
Family FLEX 10KE FLEX 10KE
Maximum Typical Gates 250,000 —
Logic Elements (LEs) 12,160 —
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) —
Logic Array Blocks (LABs) 392 (8 LEs per LAB) —
User I/O Pins 470 —
Core Supply Voltage 2.5 V —
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Speed Grade -3 (fastest) -1
Temperature Grade Commercial (0C to +70C) —
Packhaging 672-ball FineLine BGA (FC) —
Ball Pitch 1.0 mm 1.27 mm
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM —
Process Technology 0.25 um CMOS, 5-layer metal —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Family — CMOS
Typical System Gates — 250,000
Maximum User I/Os — 470
Total Pins — 672
Package Type — BGA-672
Package Size — 45 x 45 mm
Package Shape — Square
Terminal Form — Ball
Temperature na Operasyon — 0C to +70C (Commercial)
Propagation Delay — 0.4 ns
Programming Technology — In-system, SRAM-based
Configuration Interface — Serial (passive/active)

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