EPF10K250EFC672-3 vs EPF10K250EFC672-1 비교
다음의 상세 나란히 비교: EPF10K250EFC672-3 제조: Intel 및 EPF10K250EFC672-1 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPF10K250EFC672-3 | EPF10K250EFC672-1 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $99.50 | $115.00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | FLEX 10KE |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Speed Grade | -3 (fastest) | -1 |
| Temperature Grade | Commercial (0C to +70C) | — |
| 패키지 | 672-ball FineLine BGA (FC) | — |
| Ball Pitch | 1.0 mm | 1.27 mm |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | — |
| 실장 유형 | Surface Mount | Surface Mount |
| RoHS 상태 | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Maximum User I/Os | — | 470 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| 동작 온도 | — | 0C to +70C (Commercial) |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| Configuration Interface | — | Serial (passive/active) |