EPF10K30EFC256-1 vs EPF10K30EFC256-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-1 sa pamamagitan ng Intel at EPF10K30EFC256-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-1 | EPF10K30EFC256-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total RAM Bits | 24,576 | — |
| Typical Gates | 30,000 | 30,000 |
| Number of I/O | 176 | — |
| Number of Logic Gates | 119,000 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Uri ng Pagpapasok | Surface Mount | — |
| Packhaging / Kaso | 256-FBGA (17 x 17 mm, 1 mm pitch) | — |
| Supplier Device Package | 256-FBGA | — |
| Speed Grade | -1 | -1X (fastest commercial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Tindminan RoHS | Compliant (verify per lot) | — |
| Logic Elements | — | 1728 |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded Memory (EAB RAM) | — | 24,576 bits (6 EABs of 4 Kbit each) |
| User I/O | — | 176 |
| Maximum Internal Frequency | — | 250 MHz |
| Propagation Delay (tpd) | — | 0.4 ns to 0.6 ns |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V / 3.3 V / 5 V |
| Packhaging | — | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Phase-Locked Loops | — | 4 |
| Compliance | — | RoHS (check distributor for specific lot), Pb-free option available |