EPF10K30EFC256-1 vs EPF10K30EFC256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-1 sa pamamagitan ng Intel at EPF10K30EFC256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-1 | EPF10K30EFC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE | FLEX 10KE Embedded Programmable Logic Family |
| Logic Elements / Cells | 1,728 | — |
| Total RAM Bits | 24,576 | — |
| Typical Gates | 30,000 | 30,000 |
| Number of I/O | 176 | — |
| Number of Logic Gates | 119,000 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to +70 °C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 256-FBGA (17 x 17 mm, 1 mm pitch) | — |
| Supplier Device Package | 256-FBGA | — |
| Speed Grade | -1 | -2N (mid-grade, 0.6 ns) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| Tindminan RoHS | Compliant (verify per lot) | — |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Embedded Array Blocks (EABs) | — | 6 |
| User I/Os | — | 246 |
| Logic Cells | — | 1728 |
| Propagation Delay | — | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | — | 24576 |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core and I/O rail voltages] |
| Packhaging | — | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| Configuration | — | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | — | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |