EPF10K30EFC256-1 vs EPF10K30EFC256-2N 比較

詳細並排比較 EPF10K30EFC256-1 由 Intel 與 EPF10K30EFC256-2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPF10K30EFC256-1 EPF10K30EFC256-2N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Series FLEX 10KE FLEX 10KE
Family FLEX 10KE FLEX 10KE Embedded Programmable Logic Family
Logic Elements / Cells 1,728 —
Total RAM Bits 24,576 —
Typical Gates 30,000 30,000
Number of I/O 176 —
Number of Logic Gates 119,000 —
Voltage - Supply 2.375 V to 2.625 V —
工作溫度 0C to +70C (Commercial) 0 °C to +70 °C (Commercial)
安裝類型 Surface Mount Surface Mount
封裝 / 外殼 256-FBGA (17 x 17 mm, 1 mm pitch) —
Supplier Device Package 256-FBGA —
Speed Grade -1 -2N (mid-grade, 0.6 ns)
Process Technology 0.22 µm CMOS SRAM 0.22 µm CMOS, SRAM-based
RoHS 狀態 Compliant (verify per lot) —
Logic Elements (LEs) — 1,728
Embedded RAM Bits — 24,576
Embedded Array Blocks (EABs) — 6
User I/Os — 246
Logic Cells — 1728
Propagation Delay — 0.6 ns (per digchip listing; internal frequency 80 MHz)
Number of Logic Elements — 24576
供應電壓 — [DATA_NEEDED: core and I/O rail voltages]
封裝 — 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch
Configuration — Passive Serial / Active Serial / JTAG
Lead Free / RoHS — Non-RoHS (legacy, SnPb finish per FBGA-256 family)

資料表與資源

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