EPF10K30EFC256-1X vs EPF10K30EFC256-2X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-1X sa pamamagitan ng Intel at EPF10K30EFC256-2X sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30EFC256-1X EPF10K30EFC256-2X
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 1728 —
Typical Gates 30,000 —
Logic Array Blocks (LABs) 216 —
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) —
User I/O 176 —
Maximum Internal Frequency 250 MHz —
Propagation Delay (tpd) 0.4 ns to 0.6 ns —
Process Technology 0.22 µm CMOS —
Core Supply Voltage 2.5 V —
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V —
Packhaging 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) —
Speed Grade -1X (fastest commercial) -2
Temperature na Operasyon 0 °C to +70 °C (commercial) 0°C to 70°C
Configuration Method SRAM, JTAG (IEEE 1149.1) —
Phase-Locked Loops 4 —
Compliance RoHS (check distributor for specific lot), Pb-free option available —
Series — FLEX-10KE
Gates — 30,000
Logic Elements / Cells — 1,728
Number of LABs/CLBs — 216
Number of Logic Elements/Cells — 1,728
Total RAM Bits — 24,576
Number of I/O — 176
Voltage - Supply — 2.375 V to 2.625 V
Internal Frequency (Max) — 200 MHz
Propagation Delay — 0.6 ns
Technology — 0.22 µm CMOS
Supplier Device Package — 256-FBGA (17x17)
Packhaging / Kaso — 256-BGA
Uri ng Pagpapasok — Surface Mount
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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