EPF10K30EFC256-2N vs EPF10K30EFC256-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-2N sa pamamagitan ng Intel at EPF10K30EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30EFC256-2N EPF10K30EFC256-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX 10KE —
Family FLEX 10KE Embedded Programmable Logic Family FLEX 10KE
Typical Gates 30,000 30,000
Logic Elements (LEs) 1,728 —
Embedded RAM Bits 24,576 24,576
Embedded Array Blocks (EABs) 6 —
User I/Os 246 —
Logic Cells 1728 —
Propagation Delay 0.6 ns (per digchip listing; internal frequency 80 MHz) —
Number of Logic Elements 24576 —
Temperature na Operasyon 0 °C to +70 °C (Commercial) —
Volte ng Pagbibigay [DATA_NEEDED: core and I/O rail voltages] —
Process Technology 0.22 µm CMOS, SRAM-based 0.22 micrometer CMOS
Packhaging 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch 256-ball FineLine BGA
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Configuration Passive Serial / Active Serial / JTAG —
Lead Free / RoHS Non-RoHS (legacy, SnPb finish per FBGA-256 family) —
Speed Grade -2N (mid-grade, 0.6 ns) -3 (fastest)
Logic Elements / Cells — 1,728
Logic Array Blocks (LABs) — 216
User I/O Pins — 176
Maximum Operating Frequency — 200 MHz
Core Supply Voltage (VCCINT) — 2.5 V
I/O Supply Voltage (VCCIO) — 3.3 V (multi-voltage I/O standard support)
Temperature Grade — Commercial
Configuration Interface — Serial (EPC8/EPC16) and JTAG (IEEE 1149.1)
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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