EPF10K30EFC256-3N vs EPF10K30EFC256-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-3N sa pamamagitan ng Intel at EPF10K30EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30EFC256-3N EPF10K30EFC256-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 1,728 1,728
Gate Count 30,000 gates —
Logic Array Blocks (LABs) 216 216
Embedded Array Blocks (EABs) 6 —
Embedded RAM 24,576 bits —
Maximum User I/Os 176 —
Packhaging 256-pin FineLine BGA (FBGA) 256-ball FineLine BGA
Core Voltage 2.5 V —
I/O Standard Support MultiVolt 2.5 V / 3.3 V / 5.0 V —
Internal Frequency 80 MHz (typical) —
Propagation Delay (tPD) 0.6 ns —
Bidirectional I/O Performance up to 212 MHz —
PCI Compliance PCI SIG 2.2 at 33 / 66 MHz —
Process Technology 0.22 um CMOS 0.22 micrometer CMOS
Temperature na Operasyon 0 C to +70 C (Commercial) —
JTAG Support Yes (IEEE 1149.1 boundary-scan) —
Open-Drain I/O Option Yes (per pin) —
Typical Gates — 30,000
Embedded RAM Bits — 24,576
User I/O Pins — 176
Maximum Operating Frequency — 200 MHz
Core Supply Voltage (VCCINT) — 2.5 V
I/O Supply Voltage (VCCIO) — 3.3 V (multi-voltage I/O standard support)
Uri ng Pagpapasok — Surface Mount (BGA)
Speed Grade — -3 (fastest)
Temperature Grade — Commercial
Configuration Interface — Serial (EPC8/EPC16) and JTAG (IEEE 1149.1)
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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