EPM2210F256C4 vs EPM2210F256C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210F256C4 sa pamamagitan ng Altera at EPM2210F256C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210F256C4 | EPM2210F256C4N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX II | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| User I/O Pins | 212 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm |
| Core Supply Voltage | 1.8 V | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Supply Voltage (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Pin-to-pin Delay (tPD1) | 7 ns | — |
| Maximum Frequency (fMAX) | 201 MHz | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial extended) | — |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG IEEE Std. 1149.1 + ISP |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | MAX II |
| Device Type | — | CPLD |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| User Flash Memory | — | 204 Kbit |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Hanay ng Temperature na Operasyon | — | 0 °C to +85 °C (Commercial) |
| Lead-Free | — | Yes |