EPM2210F256C5N vs EPM570F256C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210F256C5N sa pamamagitan ng Intel at EPM570F256C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210F256C5N | EPM570F256C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | — |
| Logic Elements | 2210 | 570 LE |
| Macrocells | 1700 | 440 |
| User I/Os | 204 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Propagation Delay (tPD) | 7 ns | — |
| Turn-On Delay (tSU) | 11.2 ns | — |
| Maximum Internal Frequency | 201.1 MHz | 304 MHz |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.18 um CMOS with on-chip flash | 0.18 µm 6-layer-metal flash |
| Global Clocks | 4 | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Packhaging | 256-ball FineLine BGA (17x17mm, 1mm pitch) | 256-ball FineLine BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| Package Size | — | 17 mm × 17 mm |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Hanay ng Temperature na Operasyon | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |