K3KL9L90CM-MGCT vs K3KL9L90DM-JGCT Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K3KL9L90CM-MGCT sa pamamagitan ng Samsung Electronics at K3KL9L90DM-JGCT sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
K3KL9L90CM-MGCT ✓ NakahandaSamsung Electronics
K3KL9L90DM-JGCT - LPDDR5X DRAM 16Gbit FBGA-315 | Samsung
K3KL9L90DM-JGCT ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K3KL9L90CM-MGCT | K3KL9L90DM-JGCT |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | LPDDR5X SDRAM (DRAM) | LPDDR5X SDRAM |
| Laki ng Memory | 64 Gbit (8 GByte) | — |
| Memory Organization | x32 | — |
| Maximum Data Rate | 7500 Mbps | — |
| Interface | LPDDR5X | [DATA_NEEDED: channel configuration] |
| Supply Voltages | 500 mV / 900 mV / 1.05 V / 1.8 V | — |
| VDDQ | 500 mV | — |
| Temperature na Operasyon | -25C to +85C | -25C to +85C |
| Packhaging | FBGA-315 (BGA-315) | FBGA-315 |
| Ball Pitch | 0.8 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (per JLCPCB listing) | Compliant |
| Product Status | Active | — |
| Typical Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules | — |
| Memory Standard | JEDEC LPDDR5X-class (JESD209-5B family) | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Latensya ng CAS | [DATA_NEEDED: CAS latency] | — |
| Density | — | 16 Gbit |
| Rate ng Data | — | [DATA_NEEDED: data rate for JGCT speed grade] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Organisasyon | — | [DATA_NEEDED: x organization] |
| Bank Architecture | — | [DATA_NEEDED: bank/group configuration] |
| Package Dimensions | — | [DATA_NEEDED: body dimensions] |
| AEC-Q100 | — | [DATA_NEEDED: automotive qualification status] |