K3LKCKC0BM-MGCP vs K3LK4K40CM-BGCP Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K3LKCKC0BM-MGCP sa pamamagitan ng Samsung Electronics at K3LK4K40CM-BGCP sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K3LKCKC0BM-MGCP - 64Gb LPDDR5 6400Mbps DRAM | Samsung
K3LKCKC0BM-MGCP ✓ NakahandaSamsung Electronics
K3LK4K40CM-BGCP - LPDDR5 96Gb 6400Mbps DRAM | Samsung
K3LK4K40CM-BGCP ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K3LKCKC0BM-MGCP | K3LK4K40CM-BGCP |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | DRAM |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | LPDDR5 SDRAM (DRAM) | LPDDR5 SDRAM |
| Laki ng Memory | 64 Gbit | — |
| Memory Organization | 2G x32 | — |
| Rate ng Data | 6400 Mbps | 6400 Mbps per pin |
| Interface | Parallel | LPDDR5 (JEDEC) |
| Technology | CMOS | — |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V | — |
| Temperature na Operasyon | -25 C to +85 C | [DATA_NEEDED: Operating Temperature] |
| Packhaging | FBGA-315 (PBGA315) | 496-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Volatile / Non-Volatile | Volatile | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS Status] |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| Access Time | [DATA_NEEDED: access time] | — |
| Power Consumption - Active | [DATA_NEEDED: active power] | — |
| Power Consumption - Standby | [DATA_NEEDED: standby power] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 96 Gb (12 GB) |
| Organisasyon | — | 1536M x 64 |
| Supply Voltage (VDD) | — | 1.05 V |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Refresh Scheme | — | Per-bank / all-bank refresh |
| Power-Down Modes | — | Deep sleep / power-down supported |
| Application Segment | — | Mobile, embedded, computing modules |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |