K4A4G165WD-BCPB vs MT40A256M16GE-075E:B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A4G165WD-BCPB sa pamamagitan ng Samsung Electronics at MT40A256M16GE-075E:B sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron
MT40A256M16GE-075E:B ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4A4G165WD-BCPB | MT40A256M16GE-075E:B |
|---|---|---|
| Brand | Samsung Electronics | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | — | $3.95 |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Organisasyon | 256M x 16 | 256M x 16 |
| Rate ng Data | 2133 MT/s | 2666 MT/s (DDR4-2666) |
| Core Voltage | 1.2 V | — |
| Packhaging | FBGA-96 | 96-FBGA (9 x 14 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Die Generation | D-die | — |
| Bank Architecture | 4 bank groups x 4 banks | — |
| Latensya ng CAS | [DATA_NEEDED: CAS Latency at 2133 speed bin] | — |
| Burst Length | 8 (BL8, fixed/chop) | — |
| Interface | DDR4 (synchronous, source-synchronous strobe) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range for standard grade] |
| Pb-Free | Yes (per Samsung part-numbering suffix) | — |
| Tindminan RoHS | Compliant (lead-free suffix) | — |
| Refresh | Self-refresh supported (TCSR per DDR4 standard features) | 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C |
| Laki ng Memory | — | 4 Gbit |
| Memory Interface | — | Parallel |
| Clock Frequency | — | 1.33 GHz |
| VDD / VDDQ | — | 1.2 V +/-60 mV |
| VPP | — | 2.5 V, -125 mV/+250 mV |
| Internal Banks | — | 16 |
| I/O Type | — | 1.2 V pseudo open-drain |
| VREFDQ | — | On-die, internal, adjustable generation |
| Special Features | — | Temperature controlled refresh (TCR) |
| Access Time | — | [DATA_NEEDED: CAS latency / access time] |