KMPC8315ECVRAGDA vs MPC8315ECVRAGDA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng KMPC8315ECVRAGDA sa pamamagitan ng NXP Semiconductors at MPC8315ECVRAGDA sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
KMPC8315ECVRAGDA - 400MHz e300c3 MPU | NXP | Networking
KMPC8315ECVRAGDA ObsoleteNXP Semiconductors
MPC8315ECVRAGDA - PowerQUICC II Pro SoC, 400MHz, 620-HBGA | NXP
MPC8315ECVRAGDA ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | KMPC8315ECVRAGDA | MPC8315ECVRAGDA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Tapus ng Buhay |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Bus Width | 32-Bit | — |
| Core Frequency | 400 MHz | — |
| Series | MPC83xx (PowerQUICC II Pro) | MPC83xx PowerQUICC II Pro |
| Co-Processor / DSP | Security; SEC 3.3 | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Ethernet | 10/100/1000 Mbps MACs | 2x 10/100/1000 MAC (GMII/RGMII) |
| Packhaging / Kaso | 620-BBGA Exposed Pad, 29x29 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Tindminan RoHS | ROHS3 Compliant | — |
| Supply Voltage (Core) | 1 V | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +105C |
| Part Status | Obsolete | — |
| Processor Core | — | Power Architecture e300c3 |
| Architecture | — | 32-bit RISC |
| Maximum Core Frequency | — | 400 MHz |
| Width ng Data Bus | — | 32 bit |
| Memory Controller | — | DDR1/DDR2 with ECC |
| PCI/PCIe | — | 2x PCI (one configurable as PCIe) |
| USB | — | USB 2.0 (host/device) |
| Security Accelerator | — | SEC 3.x (AES, DES, 3DES, SHA, MD5) |
| TDM Interface | — | Yes (TDM/HOLC/TDM) |
| Packhaging | — | 620-ball HiCTE BGA (29x29 mm) |
| Volte ng Pagbibigay | — | Dual-rail 3.3V / 1.2V core |
| Process Node | — | 90 nm CMOS |