M1AFS250-1FG256I vs M1AFS250-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FG256I sa pamamagitan ng Microchip Technology at M1AFS250-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-1FG256I | M1AFS250-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1 - with ARM Cortex-M1) | Fusion |
| System Gates | 250000 gates | — |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Temperature na Operasyon | -40C to +85C (industrial, suffix I) | -40C ~ +100C (TJ) |
| Speed Grade | -1 | [DATA_NEEDED: speed grade] |
| Packhaging | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | 256-FPBGA (17x17) |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Gates | — | 250000 |
| Number of I/O | — | 114 |
| Total RAM Bits | — | 36864 |
| Number of Logic Elements | — | [DATA_NEEDED: Number of Logic Elements] |
| Volte ng Pagbibigay | — | 1.425V ~ 1.575V |
| Packhaging / Kaso | — | 256-LBGA |
| Packaging | — | Tray |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 16 weeks |
| Process Technology | — | 130nm, 7-layer metal, flash-based CMOS |
| System Performance | — | 350 MHz |
| Core | — | ARM Cortex-M1 |
| Tindminan RoHS | — | RoHS Non-Compliant |
| Lead Free Status | — | Contains Lead |