M1AFS600-1FGG256 vs AFS600-FGG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS600-1FGG256 sa pamamagitan ng Microchip Technology at AFS600-FGG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | M1AFS600-1FGG256 | AFS600-FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Unknown |
| Family | Fusion Mixed-Signal FPGA | — |
| Processor Core | ARM Cortex-M1 (hard core) | — |
| System Gates | 600000 | 600,000 gates |
| Configurable Logic Blocks (CLBs) | 13824 | — |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS, flash-based | 130 nm |
| Configuration Memory | Flash (non-volatile, live at power-up) | Flash-based nonvolatile memory |
| Temperature na Operasyon | 0C to +85C | 0°C to 70°C |
| Packhaging | 256-ball LBGA (FGG256), 17x17x1.7 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface mount |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| Tindminan RoHS | Compliant | — |
| Packaging | Tray | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Volte ng Pagbibigay | — | 1.5 V |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Maksimum na Taktiko ng Oras | — | 1098.9 MHz |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Packing Media | — | Tray |
| RoHS | — | Compliant |