M1AFS600-1FGG256 vs AFS600-FGG256 比較

詳細並排比較 M1AFS600-1FGG256 由 Microchip Technology 與 AFS600-FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS600-1FGG256 M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 ✓ 啟用中
Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown

規格比較

參數 M1AFS600-1FGG256 AFS600-FGG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 Unknown
Family Fusion Mixed-Signal FPGA —
Processor Core ARM Cortex-M1 (hard core) —
System Gates 600000 600,000 gates
Configurable Logic Blocks (CLBs) 13824 —
Flip-Flops 110592 —
User I/O 119 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm CMOS, flash-based 130 nm
Configuration Memory Flash (non-volatile, live at power-up) Flash-based nonvolatile memory
工作溫度 0C to +85C 0°C to 70°C
封裝 256-ball LBGA (FGG256), 17x17x1.7 mm —
安裝類型 Surface Mount Surface mount
Analog Features Configurable analog blocks, clock generation and management —
RoHS 狀態 Compliant —
Packaging Tray —
Device Type — Fusion mixed-signal FPGA
Configurable Logic Cells — 13,824 cells
I/O Count — 119 I/Os
供應電壓 — 1.5 V
Logic Family — CMOS
Metal Layers — 7 layers
Configuration Feature — Live at Power-Up (LAPU)
最大時脈頻率 — 1098.9 MHz
Package Type — 256-pin FBGA
Package Pitch — 1.0 mm
Packing Media — Tray
RoHS — Compliant

資料表與資源

瀏覽所有產品 建立 BOM 索取報價