M29DW323DB70N3E vs M29W320DT70N3E Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M29DW323DB70N3E sa pamamagitan ng Micron Technology at M29W320DT70N3E sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
M29DW323DB70N3E - 32Mb NOR Flash 70ns 48-TSOP | Micron
M29DW323DB70N3E ✓ NakahandaMicron Technology
M29W320DT70N3E - 32Mbit NOR Flash 70ns 48-TSOP | Micron
M29W320DT70N3E ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M29DW323DB70N3E | M29W320DT70N3E |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | Flash - NOR | NOR Flash |
| Memory Format | FLASH | — |
| Technology | FLASH - NOR Memory IC | — |
| Density | 32 Mb (4M x 8, 2M x 16) | — |
| Memory Organization | 4M x 8 / 2M x 16 | — |
| Interface | Parallel | Parallel |
| Access Time | 70 ns | 70 ns |
| Volte ng Pagbibigay | 3 V class (per manufacturer datasheet) | — |
| Temperature na Operasyon | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Packhaging | 48-TSOP I | 48-TSOP I |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Boot Block Location | Bottom (DB variant) | — |
| Byte/Word Organization Select | Yes (BYTE pin) | — |
| Applications Domain | Embedded code storage / XIP | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Standard Pack Quantity | [DATA_NEEDED: standard pack quantity] | — |
| Laki ng Memory | — | 32 Mbit |
| Organisasyon | — | 4M x8 / 2M x16 |
| Supply Voltage (VCC) | — | 2.7 V to 3.6 V |
| Read Current (typical) | — | 10 mA |
| Boot Block Architecture | — | Top boot (DT suffix) |
| Boot Region | — | 16 KByte boot block, two 8 KByte parameter blocks, 32 KByte small main block |
| Package Length | — | 18.4 mm |
| Level ng MSL | — | 3 (168 Hours) |
| Peak Reflow Temperature Time | — | 30 s |
| Packaging | — | Tray |
| Program/Erase Cycles | — | [DATA_NEEDED: endurance] |