M29W800FB70N3F vs M29W160EB70N3E Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M29W800FB70N3F sa pamamagitan ng Micron Technology at M29W160EB70N3E sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
M29W800FB70N3F - 8Mb Parallel NOR Flash 70ns TSOP-48 | Micron
M29W800FB70N3F ✓ NakahandaMicron Technology
M29W160EB70N3E - 16Mbit NOR Flash 70ns 48-TSOP | Micron
M29W160EB70N3E ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M29W800FB70N3F | M29W160EB70N3E |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Density | 8 Mbit | — |
| Organisasyon | 512K x 16 / 1M x 8 | 2M x8 / 1M x16 |
| Access Time | 70 ns | 70 ns |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Uri ng Interface | Parallel | — |
| Uri ng Memory | NOR Flash (Boot Block) | FLASH - NOR |
| Boot Block Location | Bottom | — |
| Block Count | 19 memory blocks (1 boot, 3 parameter, 15 main) | — |
| Bus Width Selection | x8 / x16 via BYTE# pin | — |
| Programming Time | 10 us per byte/word (typical) | 10 us (typical) |
| CFI Compliant | Yes | — |
| Erase Suspend/Resume | Yes | — |
| Packhaging | TSOP-48 (12 x 20 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | -40C to +125C |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tape & Reel | Tray |
| Laki ng Memory | — | 16 Mbit (2M x8, 1M x16) |
| Interface | — | Parallel |
| Cell Type | — | SLC NOR |
| Packhaging / Kaso | — | 48-TFSOP (0.724 in, 18.40 mm width) |
| Speed Grade | — | -70 |
| FBGA Code | — | N/A (TSOP package) |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |