MC8641DVJ1333JE vs MC8641VU1500KE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC8641DVJ1333JE sa pamamagitan ng NXP Semiconductors at MC8641VU1500KE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC8641DVJ1333JE - Dual e600 SoC, 2x1333 MHz, Rev 3 | NXP Semiconductors
MC8641DVJ1333JE ⚠ Huling PagbiliNXP Semiconductors
MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP
MC8641VU1500KE ObsoletePagsanggunian na paghahambing
| Parametro | MC8641DVJ1333JE | MC8641VU1500KE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Core Architecture | PowerPC e600 (dual-core) | — |
| Number of Cores | 2 | 1 |
| Core Frequency | 1333 MHz | — |
| Width ng Data Bus | 32-bit | 32-bit |
| SIMD Extensions | AltiVec | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet | 2x 10/100/1000 (Gigabit) MACs | 4 x 10/100/1000 Mbps MAC |
| PCI Express | Yes | Dual x4 PCIe endpoints |
| Serial RapidIO (SRIO) | Yes | — |
| Temperature na Operasyon | 0°C to +105°C | 0°C to +105°C |
| Packhaging | 1023-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm), ceramic flip-chip |
| Uri ng Pagpapasok | Surface Mount | — |
| Silicon Revision | Rev 3 | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS compliant (ceramic BGA) |
| Core Processor | — | PowerPC e600 |
| Maximum Core Frequency | — | 1.5 GHz |
| Supply Voltage (Core) | — | 1.05 V |
| Supply Voltage (I/O) | — | 1.1 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Controllers | — | DDR1, DDR2 (with ECC) |
| Serial RapidIO | — | Yes |
| AltiVec SIMD Engine | — | Yes (128-bit) |
| Cryptographic Acceleration | — | AES, DES/3DES, RSA, ECC |
| Bilang ng Pin | — | 1023 (effective BGA balls) |
| Process Technology | — | 90 nm CMOS |