MC9S08DN32ACLC vs MC9S08DN60ACLC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DN32ACLC sa pamamagitan ng NXP Semiconductors at MC9S08DN60ACLC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteNXP Semiconductors
MC9S08DN60ACLC - 8-bit HCS08 MCU, 60KB Flash, USB, 32-LQFP | NXP
MC9S08DN60ACLC ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MC9S08DN32ACLC | MC9S08DN60ACLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Series | S08DN | — |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz (20 MHz bus) | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| RAM Size | 2 KB | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of Interrupt Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND | — |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Packhaging | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C | -40 C to +85 C |
| Part Status | Obsolete | — |
| Core | — | HCS08 (enhanced 8-bit) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 2 KB (2K x 8) |
| USB Controller | — | USB 2.0 full-speed device with on-chip transceiver |
| On-chip Voltage Regulator | — | 3.3 V, up to 100 mA for external load |
| CAN | — | Not present (NO CAN variant) |
| ADC | — | 10-bit |
| Timers | — | TPM (Timer/PWM), Real-Time Counter |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Oscillator | — | External crystal/oscillator |
| Packaging (shipping) | — | Tray |
| Level ng MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Tindminan RoHS | — | Compliant |