MC9S08DZ60ACLF vs S9S08DZ60F1MLF Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DZ60ACLF sa pamamagitan ng NXP Semiconductors at S9S08DZ60F1MLF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndNXP Semiconductors
S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP
S9S08DZ60F1MLF ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MC9S08DZ60ACLF | S9S08DZ60F1MLF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Core | HCS08 (8-bit CISC) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1 x CAN 2.0 A/B | — |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | — |
| Packhaging | 48-LQFP (7x7 mm) | — |
| Temperature na Operasyon | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | [DATA_NEEDED: full operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | MSL 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: confirm RoHS lead-free finish] |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 with BGND instruction |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |
| Product Type | — | 8-Bit Microcontroller (MCU) |
| Core Architecture | — | HCS08 (enhanced HCS08 core) |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) FLASH |
| RAM Size | — | 4 KB (4K x 8) |
| Number of I/O Lines | — | 39 |
| Packhaging / Kaso | — | 48-LQFP (7x7 mm) |
| Volte ng Pagbibigay | — | 3.3 V / 5 V |
| Terminal Form | — | GULL WING |
| Temperature Grade | — | Automotive (per part suffix 'F' / 'LF') |
| Oscillator Type | — | External (per package options) |
| Peripherals | — | MSCAN (CAN 2.0), SCI, SPI, ADC, Timers |