MC9S08DZ60ACLF vs S9S08DZ60F1MLF 比較

詳細並排比較 MC9S08DZ60ACLF 由 NXP Semiconductors 與 S9S08DZ60F1MLF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08DZ60F1MLF S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF ✓ 啟用中

規格比較

參數 MC9S08DZ60ACLF S9S08DZ60F1MLF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Core HCS08 (8-bit CISC) —
Core Frequency 40 MHz (20 MHz bus) —
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
EEPROM / Emulated EEPROM Available (size [DATA_NEEDED: EEPROM size]) —
Operating Voltage 2.7 V to 5.5 V —
Supply Rails 3.3 V / 5 V —
ADC 24-channel, 12-bit, 2.5 us conversion —
CAN 1 x CAN 2.0 A/B —
LIN Master LIN 2.0 interface —
Communication Peripherals SCI (SPI), IIC, MSCAN —
Timer / PWM Channels Multiple (count [DATA_NEEDED: timer/PWM channel count]) —
LCD Driver Yes (on-chip segment LCD driver) —
封裝 48-LQFP (7x7 mm) —
工作溫度 -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] [DATA_NEEDED: full operating temperature range]
安裝類型 Surface Mount Surface Mount
MSL 等級 MSL 3 (per JEDEC J-STD-020) [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
RoHS 狀態 Compliant [DATA_NEEDED: confirm RoHS lead-free finish]
Background Debug Mode (BGND) Yes (on-chip emulation/debug) —
Instruction Set HC08 instruction set with added BGND instruction HC08 with BGND instruction
Manufacturer — NXP USA Inc. (formerly Freescale Semiconductor)
Product Type — 8-Bit Microcontroller (MCU)
Core Architecture — HCS08 (enhanced HCS08 core)
CPU Speed — 40 MHz (20 MHz bus)
Program Memory Size — 60 KB (60K x 8) FLASH
RAM Size — 4 KB (4K x 8)
Number of I/O Lines — 39
封裝 / 外殼 — 48-LQFP (7x7 mm)
供應電壓 — 3.3 V / 5 V
Terminal Form — GULL WING
Temperature Grade — Automotive (per part suffix 'F' / 'LF')
Oscillator Type — External (per package options)
Peripherals — MSCAN (CAN 2.0), SCI, SPI, ADC, Timers

資料表與資源

瀏覽所有產品 建立 BOM 索取報價