MC9S08QD2CSC vs S9S08QD4J2MSCR Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08QD2CSC sa pamamagitan ng NXP Semiconductors at S9S08QD4J2MSCR sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08QD2CSC MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)

MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)

MC9S08QD2CSC ✓ Nakahanda
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MC9S08QD2CSC S9S08QD4J2MSCR
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Katayuan ng Stock In Stock —
Presyo ng Yunit (USD) $2.05 —
Core Processor S08 —
Core Size 8-Bit —
Instruction Set Architecture CISC CISC (68 HC08 with added BGND)
Speed (Bus Frequency) 16 MHz —
Program Memory Type Flash Flash
Program Memory Size 2KB (2K x 8) 4 KB (4K x 8)
RAM Size 128 x 8 —
Number of I/O 4 —
Volte ng Pagbibigay 3.3 V / 5 V 2.7 V to 5.5 V
Oscillator Type Internal —
Packhaging / Kaso 8-SOIC (0.154 in, 3.90 mm Width) —
Uri ng Pagpapasok Surface Mount Surface Mount
Packaging Tape & Reel Tape & Reel (TR)
Technology CMOS —
Product Series S08QD (9S08QD4 SERIES per distributor listing) —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Temperature na Operasyon [DATA_NEEDED: operating temperature range] -40 C to +125 C
Core — HCS08
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Packhaging — 8-SOIC (0.154 inch, 3.90 mm width)
I/O Pins — 4
ADC — 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers — TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints

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