MC9S08QD4MSCR vs MC9S08QG4CFFE Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08QD4MSCR sa pamamagitan ng NXP Semiconductors at MC9S08QG4CFFE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08QD4MSCR MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR ✓ Nakahanda
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro MC9S08QD4MSCR MC9S08QG4CFFE
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Tapus ng Buhay
Core HCS08 (S08 core) —
Width ng Data Bus 8 bit —
Maximum CPU Frequency 16 MHz —
Program Memory Size 4 KB (4K x 8) Flash 4KB (4K x 8) FLASH
RAM Size 256 B —
Packhaging 8-SOIC (SO-8) 16-QFN-EP (5x5 mm), QFN EP
Operating Voltage Range 2.7 V to 5.5 V —
Hanay ng Temperature na Operasyon -40 C to +125 C [DATA_NEEDED: operating temperature range]
ADC 10-bit, 4 channels —
Timers Two 16-bit TPM —
Communication Interface SCI (UART) —
Debug Interface Background Debug Mode (BDM), single breakpoint —
Instruction Set HC08 with added BGND instruction —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant —
Level ng MSL [DATA_NEEDED: MSL Level] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Maksimum na Taktiko ng Oras — 20 MHz
Volte ng Pagbibigay — 2.5 V / 3.3 V
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Katayuan ng Lifecycle — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

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