MC9S08QE4CPG vs MC9S08QD4CSC Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08QE4CPG sa pamamagitan ng NXP Semiconductors at MC9S08QD4CSC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08QE4CPG MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG ✓ Nakahanda
NXP Semiconductors
MC9S08QD4CSC MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro MC9S08QE4CPG MC9S08QD4CSC
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Tapus ng Buhay
Core S08 (HCS08) 8-bit CPU —
CPU Maximum Frequency 20 MHz (50.33 MHz bus at VDD >= 2.1 V) —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 512 B 256 B
Supply Voltage (VDD) 1.8 V to 3.6 V —
Hanay ng Temperature na Operasyon -40C to +85C (industrial) —
Packhaging 16-pin PDIP (DIP-16, through-hole) 8-SOIC
I/O Pins Up to 12 general-purpose I/O (per 16-pin package) —
ADC Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] —
Timers Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] —
Communication SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] —
Low-Power Stop Mode Current Approx. 1 uA —
Debug Interface Background Debug Mode (BDM) Background debugging system (single-wire BDM)
Uri ng Pagpapasok Through-Hole (PDIP) Surface Mount
Tindminan RoHS Compliant —
Family S08QE (Flexis, 8/32-bit pin-compatible family) —
Lifecycle Stage ACTIVE —
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-bit
Maksimum na Taktiko ng Oras — 16 MHz
Flash Memory — 4 KB (4K x 8)
Volte ng Pagbibigay — 3.3 V / 5 V
ADC Resolution — 10-bit
ADC Channels — 4
General-Purpose I/O — 6
Instruction Set — HC08 with added BGND instruction
Packaging — Tube
Temperature na Operasyon — [DATA_NEEDED: operating temperature range]
Life Cycle Stage — End of Life (per NXP product page)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita