MC9S12DG256BCPV vs MC9S12DG256BVPV Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DG256BCPV sa pamamagitan ng NXP Semiconductors at MC9S12DG256BVPV sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DG256BVPV - 16-bit 25MHz HCS12 MCU 256KB Flash | NXP
MC9S12DG256BVPV ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MC9S12DG256BCPV | MC9S12DG256BVPV |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Core Processor | HCS12 | HCS12 (CPU12) |
| Core Size | 16-bit | 16-bit |
| Core Architecture | CISC | — |
| Maximum Clock Speed | 25 MHz | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash | 256 KB (256K x 8) Flash |
| Program Memory Type | Flash | — |
| RAM Size | 12 KB | 12 KB |
| EEPROM Size | 4 KB x 8 | 4 KB |
| Number of I/O | 91 | 91 |
| Volte ng Pagbibigay | 2.5 V / 5 V | — |
| Oscillator Type | Internal | Internal PLL + external crystal |
| Connectivity | CANbus, I2C, SCI, SPI | CAN 2.0 A/B, I2C, SPI, 2x SCI |
| Peripherals | PWM, WDT | PWM, WDT, POR, LVD, BDM debug |
| Packhaging / Kaso | 112-LQFP (20 x 20 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40 C to +85 C |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Packhaging | — | 112-LQFP (20x20 mm) |
| Supply Voltage na Operasyon | — | 2.5 V core / 5 V I/O (single 5 V supply with internal regulator) |
| ADC | — | 2 x 8-channel 10-bit |
| PWM Channels | — | 8 |
| Communication Interfaces | — | CAN, I2C, SCI, SPI |
| Data Converters | — | A/D 16x10b |
| Level ng MSL | — | 3 (168 hours) |