MCF52277CVM160J vs SCF5250VM120 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCF52277CVM160J sa pamamagitan ng NXP Semiconductors at SCF5250VM120 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MCF52277CVM160J - ColdFire V2 32-bit MPU 166MHz | NXP
MCF52277CVM160J ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MCF52277CVM160J | SCF5250VM120 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Unknown |
| Core Architecture | ColdFire V2 (32-bit RISC) | — |
| Maksimum na Taktiko ng Oras | 166.67 MHz | — |
| Program Memory | ROMless (external memory required) | ROMless |
| Internal SRAM | 128 KB | — |
| Instruction/Data Cache | 8 KB configurable | — |
| LCD Controller | Integrated (supports TFT up to SVGA) | — |
| Touchscreen Controller | Integrated 4-wire resistive | — |
| Ethernet MAC | 10/100 Mbps with on-chip PHY | — |
| USB Interface | USB 2.0 Full-Speed On-The-Go | — |
| CAN Interface | FlexCAN | — |
| UART Channels | 3 | — |
| I2C Channels | 2 | — |
| SPI Channels | 2 | — |
| External Bus Interface | Yes (32-bit) | — |
| Debug Interface | BDM + JTAG | — |
| Packhaging | 196-ball MAP-BGA (15 x 15 mm) | 196-LBGA (15 x 15 mm) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Supply Voltage (Core) | 1.5 V nominal | — |
| Supply Voltage (I/O) | 3.3 V nominal | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Architecture | — | RISC 32-bit |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Number of I/O Pins | — | 57 |
| Volte ng Pagbibigay | — | 3.3 V |
| Process Technology | — | 0.13 um |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |