MPC5554MVR132 vs MPC5554MZP132 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC5554MVR132 sa pamamagitan ng NXP Semiconductors at MPC5554MZP132 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd
NXP Semiconductors
MPC5554MZP132 MPC5554MZP132 - 132MHz 2MB Flash Automotive MCU | NXP

MPC5554MZP132 - 132MHz 2MB Flash Automotive MCU | NXP

MPC5554MZP132 Nrnd

Pagsanggunian na paghahambing

Parametro MPC5554MVR132 MPC5554MZP132
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle NRND NRND
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Packhaging 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-pin plastic PBGA
Uri ng Pagpapasok Surface Mount Surface mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Hanay ng Temperature na Operasyon -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
Tindminan RoHS Compliant —
Level ng MSL 3 (per JEDEC J-STD-020) —
Product Type — 32-bit automotive microcontroller
Processor Core — e200z6 Power Architecture core
Operating Frequency — 132 MHz
Flash Memory — 2 MB (2M x 8)
Architecture — Book E-compliant Power Architecture
Package Dimensions — 27 x 27 mm
Package Pitch — 1 mm
Package Material — Lead-free plastic
Package Outline — MS-034AAL-1
Temperature na Operasyon — -40 °C to +125 °C
Automotive Grade — Automotive grade
Primary Application — Engine management and powertrain control
Instruction Set — 32-bit
Flash Organization — 2M x 8 bits
Katayuan ng Lifecycle — NRND

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