MPC8255ACVVMHBB vs MPC8255AVVMHBB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8255ACVVMHBB sa pamamagitan ng NXP Semiconductors at MPC8255AVVMHBB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | MPC8255ACVVMHBB | MPC8255AVVMHBB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | PowerPC G2, 32-bit |
| Number of Cores | 1 | 1 |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Packhaging | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Non-compliant (NO-PB suffix - lead-bearing) |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Bus Frequency | — | 133 MHz (core-to-memory bus) |
| Cache (I/D) | — | 16 Kbyte instruction / 16 Kbyte data |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Integrated Ethernet MAC | — | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | — | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | — | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Temperature na Operasyon | — | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | — | 0.18 micrometre CMOS |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Lifecycle | — | No Longer Manufactured (NXP) |