MPC8260AZUPJDB vs XPC8260CVVIFBC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8260AZUPJDB sa pamamagitan ng NXP Semiconductors at XPC8260CVVIFBC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Huling PagbiliNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPC8260AZUPJDB | XPC8260CVVIFBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II (MPC8260A HiP4) | PowerQUICC II (PQ II HIP 3) |
| Core | PowerPC G2, single core | — |
| Width ng Data Bus | 32-bit | — |
| Maksimum na Taktiko ng Oras | 300 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Core Supply Voltage | 1.9 V to 2.2 V | 2.5 V |
| I/O Supply Voltage | 3.3 V | — |
| Process Technology | 0.25 micrometer CMOS (HiP4) | — |
| Packhaging | 480-TBGA (37.5 x 37.5 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Communications Processor Module (CPM) | Integrated (FCC, SCC, SMC) | Integrated (per PowerQUICC II architecture) |
| External Bus | 60x bus, 64-bit data | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | Tray |
| Lifecycle | End-of-Life / Last Time Buy (per NXP PCN) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Packhaging / Kaso | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |