MPC8547EVTATGD vs MPC8543VTANGD Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8547EVTATGD sa pamamagitan ng NXP Semiconductors at MPC8543VTANGD sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MPC8547EVTATGD MPC8543VTANGD
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Obsolete Aktibo
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Width 32-Bit —
Core Frequency 1.2 GHz —
Series MPC85xx (PowerQUICC III) PowerQUICC III
Co-Processors / DSP Signal Processing Engine (SPE); Security Engine (SEC 3.x) —
L1 Cache (I/D) 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table] —
L2 Cache 256 KB [DATA_NEEDED: confirm from datasheet] 256 KB
RAM Controllers DDR, DDR2, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers None integrated —
Ethernet 4 x 10/100/1000 Mbps (GigE) —
PCI / PCIe / SRIO PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO —
Other I/O Local bus, I2C, DUART, GPIO, USB 2.0, SPI —
Temperature na Operasyon 0C to +105C (industrial grade per -TGD suffix) 0 °C to +105 °C
Core Voltage 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table] 1.0 V (typical)
I/O Voltages 1.8V / 2.5V / 3.3V 1.8 V / 2.5 V / 3.3 V
Operating Temperature Range per DigiKey -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm] —
Packhaging / Kaso 783-BBGA, FCBGA (29 x 29 mm) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Part Status Obsolete —
Process Technology 0.09 um CMOS 90 nm CMOS
Tindminan RoHS Compliant [DATA_NEEDED: confirm via NXP product page] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Package Type — FCBGA-783 (29x29 mm)

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