MPC8572VTAVNE vs MPC8572ELVTAVND Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8572VTAVNE sa pamamagitan ng NXP Semiconductors at MPC8572ELVTAVND sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE ✓ NakahandaNXP Semiconductors
MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPC8572VTAVNE | MPC8572ELVTAVND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) | PowerPC e500, dual-core |
| Number of Cores | 2 | — |
| Core Clock Frequency (max) | 1.5 GHz | — |
| Hanay ng Temperature na Operasyon | 0 C to +105 C | — |
| Core Voltage | 1.1 V | — |
| L2 Cache | 1 MB (shared) | 1 MB shared |
| Memory Controller | DDR2 / DDR3 with ECC | Dual DDR2 with ECC |
| PCI Express | 3 x PCIe interfaces | — |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) | — |
| Serial RapidIO | Yes | — |
| Security Engine | Integrated | AES, DES, 3DES, Kasumi, SHA-1/256 |
| Packhaging | 1023-ball FCBGA, 33 mm x 33 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL classification] | — |
| Tindminan RoHS | compliant | — |
| Product Family | PowerQUICC III (MPC85xx) | — |
| Process Node | [DATA_NEEDED: fabrication process] | — |
| Part Family | — | PowerQUICC III MPC85xx |
| Width ng Data Bus | — | 32-bit |
| Maximum Clock Speed | — | 1.5 GHz |
| Operating Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um (90 nm) CMOS |
| Packhaging / Kaso | — | 1023-FCBGA (33x33 mm) |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| Ethernet | — | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | — | PCI Express x8, Serial RapidIO |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Compliance | — | RoHS status [DATA_NEEDED: rohs status] |