MPC860TVR50D4 vs MPC860PCZQ50D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860TVR50D4 sa pamamagitan ng NXP Semiconductors at MPC860PCZQ50D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC860TVR50D4 | MPC860PCZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Tapus ng Buhay |
| Core Architecture | PowerPC 32-bit | PowerPC 603 (32-bit, no FPU) |
| Core Count | 1 | — |
| Maksimum na Taktiko ng Oras | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Packhaging / Kaso | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 micron CMOS |
| Instruction Cache | 4 Kbyte | 4 Kbyte |
| Data Cache | 4 Kbyte | 4 Kbyte |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Hanay ng Temperature na Operasyon | -40°C to +95°C | -40C to +85C (industrial, 'PC' suffix) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | MPC8xx PowerQUICC | — |
| Tindminan RoHS | [DATA_NEEDED: rohs compliance] | Non-Compliant (contains lead) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit MPU |
| Core Frequency | — | 50 MHz |
| Number of Cores | — | 1 (CPU + CPM RISC engine) |
| Operating Voltage - I/O | — | 3.3 V |
| Internal Core Voltage | — | 2.2 V or 1.8 V (selection required) |
| MMU | — | Yes (32-bit virtual addressing) |
| On-chip Ethernet MAC | — | 2x 10/100 Mbps (MII interface) |
| Packhaging | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead |
| Katayuan ng Lifecycle | — | End of Life |