MPC866TZP133A vs MPC859TVR133A Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC866TZP133A sa pamamagitan ng NXP Semiconductors at MPC859TVR133A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP
MPC866TZP133A ObsoleteNXP Semiconductors
MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA
MPC859TVR133A ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC866TZP133A | MPC859TVR133A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Tapus ng Buhay |
| Core Processor | MPC8xx Power Architecture (32-bit) | — |
| Core Speed | 133 MHz | — |
| External Bus Speed | 66 MHz | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications Processor Module (CPM) | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V (5 V TTL tolerant inputs) | — |
| Process Technology | 0.18 µm CMOS | — |
| Packhaging | 357-PBGA (25x25 mm, 1.0 mm pitch) | — |
| Ethernet MACs | 4 x 10/100 Mbps + 2 x 10 Mbps | — |
| RAM Controllers | DRAM (up to 16 banks), SRAM, EPROM, Flash | — |
| Graphics Acceleration | No | — |
| Temperature na Operasyon | 0 °C to +95 °C | 0C to +95C (commercial/industrial grade) |
| Lead Free Status | Contains Lead | — |
| Tindminan RoHS | Non-Compliant (contains lead - per datasheet) | See manufacturer PCN (legacy status) |
| Part Status | Obsolete | — |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | PowerQUICC, MPC8xx family |
| Core Architecture | — | Power Architecture (32-bit) |
| Core / Series Name | — | MPC8xx |
| Maksimum na Taktiko ng Oras | — | 133 MHz |
| Width ng Data Bus | — | 32 bit |
| Package Type | — | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 25 x 25 mm |
| On-Chip Cache | — | 8 KB instruction / 8 KB data (per datasheet family) |
| Communication Channels | — | 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) |
| Peripheral Interfaces | — | SPI, I2C, PCMCIA, IDMA, UART |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Lifecycle | — | End-of-Life per NXP product page |