MSC8251SVT1000B vs MSC8154ETVT1000B Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MSC8251SVT1000B sa pamamagitan ng NXP Semiconductors at MSC8154ETVT1000B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8154ETVT1000B MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8154ETVT1000B Obsolete

Pagsanggunian na paghahambing

Parametro MSC8251SVT1000B MSC8154ETVT1000B
Brand NXP Semiconductors NXP Semiconductors
Kategorya DSP DSP
Katayuan ng Lifecycle Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Core Architecture SC3850 StarCore, single core StarCore SC3850 (quad-core)
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB 32 KB per core
L1 Data Cache 32 KB 32 KB per core
L2 Unified Cache 512 KB (configurable, SRAM or MAP) 512 KB
On-Chip RAM 576 KB 576 KB
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) —
Serial RapidIO Yes (SERDES-based) —
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
Uri ng Pagpapasok Surface Mount —
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
Tindminan RoHS Compliant Compliant
Temperature na Operasyon [DATA_NEEDED: operating temperature grade] —
Number of Cores — 4
Core Clock Frequency — 1 GHz
Performance — 1000 MIPS per core (4000 MIPS aggregate)
On-Chip ROM — 96 KB
External Memory Interface — DDR2/DDR3 controller
High-Speed Serial Interfaces — Serial RapidIO, PCI Express
Ethernet Interfaces — 2x RGMII Gigabit Ethernet MACs
Peripheral Interfaces — I2C, SPI, UART, TDM
Security Engine — Integrated (IPSec, Kasumi, Snow 3G)
Packhaging — 783-FCPBGA (29x29 mm)
Operating Temperature Grade — Industrial

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