OSD3358-512M-ISM vs OSD3358-512M-BSM Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng OSD3358-512M-ISM sa pamamagitan ng Octavo Systems at OSD3358-512M-BSM sa pamamagitan ng Octavo Systems. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ NakahandaOctavo Systems
OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo
OSD3358-512M-BSM ✓ NakahandaPagsanggunian na paghahambing
| Parametro | OSD3358-512M-ISM | OSD3358-512M-BSM |
|---|---|---|
| Brand | Octavo Systems | Octavo Systems |
| Kategorya | Wireless Modules | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) | — |
| Series | OSD3358 | — |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD | — |
| CPU Speed | 1 GHz | — |
| RAM Size | 512 MB DDR3 | — |
| PMIC | TPS65217C | — |
| Auxiliary LDO | TL5209 | — |
| EEPROM | 4 KB | — |
| Packhaging | 256-ball BGA, 21 mm x 21 mm | 256-ball BGA 21x21 mm, 1.27 mm pitch |
| Form Factor | SiP (System-in-Package) | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Temperature na Operasyon | -40C to +85C (industrial) | 0 C to +70 C (commercial, BSM grade) |
| Volte ng Pagbibigay | [DATA_NEEDED: main rail voltage] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA reflow) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tray Quantity | [DATA_NEEDED: tray qty] | — |
| Module Type | — | System-in-Package (SiP) with AM3358 + DDR3 + PMIC |
| Processor Core | — | Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit |
| Maximum CPU Clock | — | 1 GHz (with NEON SIMD and FPU) |
| Graphics Accelerator | — | PowerVR SGX530 3D GPU |
| System Memory | — | 512 MB 32-bit DDR3 (on-package) |
| Memory Bus Width | — | 32-bit + ECC option |
| Peripheral Co-Processors | — | 2x PRU-ICSS (Programmable Real-time Unit) |
| Ethernet | — | 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) |
| USB | — | 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role |
| Other Interfaces | — | 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC |
| Operating Voltage | — | 5 V single rail via on-board PMIC |