RTAX2000DL-1CQ352V vs RTAX2000SL-1CQ352V Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng RTAX2000DL-1CQ352V sa pamamagitan ng Microchip Technology at RTAX2000SL-1CQ352V sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000DL-1CQ352V ✓ NakahandaMicrochip Technology
RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000SL-1CQ352V ✓ NakahandaPagsanggunian na paghahambing
| Parametro | RTAX2000DL-1CQ352V | RTAX2000SL-1CQ352V |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | RTAX-DSP (RTAX2000DL) | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 2,000,000 (approx.) | 2,000,000 |
| Logic Cells | 29,568 | 32,256 |
| CLBs | 19,712 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) | 1.5 V (1.425 V to 1.575 V) |
| Technology | Digital CMOS | — |
| Programming Technology | Antifuse (one-time programmable) | — |
| Radiation Tolerance | Radiation-tolerant (RTAX-DSP) | Radiation-tolerant (space flight grade) |
| Configuration | Live at power-up, no external boot memory | Live at power-up, single chip (antifuse) |
| Speed Grade | -1 | — |
| Packhaging | CQ352 (352-pin ceramic QFP) | 352-pin ceramic CQFP (CQ352) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Application Domain | Space-flight systems | Space flight systems |
| Special Features | DSP multiply-accumulate blocks (DL variant) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | — |
| CLB Count | — | 21,504 |
| Process Technology | — | CMOS, antifuse OTP interconnect |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control |
| Clocking | — | Segmentable clock resources, chip-wide highway routing |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O bank voltage] |
| Total Ionizing Dose (TID) | — | [DATA_NEEDED: TID rating] |
| Level ng MSL | — | Not applicable (ceramic package) |