S912XD128F2MAL vs S912XDG128F2MAL Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S912XD128F2MAL sa pamamagitan ng NXP Semiconductors at S912XDG128F2MAL sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
S912XD128F2MAL ✗ Tapus ng BuhayNXP Semiconductors
S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive
S912XDG128F2MAL ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | S912XD128F2MAL | S912XDG128F2MAL |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Tapus ng Buhay |
| Core Architecture | HCS12X (16-bit) | — |
| Instruction Set | Upward-compatible with HCS12 | — |
| Program Flash | 128 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum CPU Frequency | 80 MHz | — |
| Operating Voltage | [DATA_NEEDED: VDD range] | — |
| Volte ng Pagbibigay | 5 V (typical automotive) | 2.5 V / 5 V |
| Hanay ng Temperature na Operasyon | -40 °C to +125 °C | — |
| Temperature Grade | Automotive | — |
| Packhaging | 112-LQFP (20x20 mm) | — |
| Terminal Form | Gull Wing | Gull Wing |
| Number of Terminals | 112 | — |
| Package Code | QFP | — |
| Package Shape | Square | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| ADC | 10-bit | — |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C | — |
| Timers | ECT, PWM, TIM (16-bit) | — |
| External Bus Interface | Yes (multiplexed) | — |
| Debug Interface | BDM | — |
| RoHS | Compliant per distributor listings | — |
| Core Processor | — | HCS12X (16-bit CISC) |
| Core Size | — | 16-bit |
| Speed | — | 80 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 12K x 8 |
| Number of I/O | — | 91 |
| Packhaging / Kaso | — | 112-LQFP (20x20 mm) |
| Temperature na Operasyon | — | -40 degC to +125 degC |
| Industry Application | — | Automotive |
| Qualification | — | AEC-Q100 |
| Architecture Compatibility | — | Upward compatible with HCS12 instruction set |
| Packaging | — | Tray |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |