S9S08LG32J0VLK vs MC9S08QD4CSC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S9S08LG32J0VLK sa pamamagitan ng NXP Semiconductors at MC9S08QD4CSC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
S9S08LG32J0VLK - 32KB Flash LCD 8-bit MCU | NXP/Freescale | Auto
S9S08LG32J0VLK ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | S9S08LG32J0VLK | MC9S08QD4CSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Tapus ng Buhay |
| Core Architecture | HCS08 (S08), 8-bit | — |
| Program Flash | 32 KB (32K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| Maximum CPU Frequency | 40 MHz bus clock | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Temperature na Operasyon | -40C to +105C | [DATA_NEEDED: operating temperature range] |
| I/O Ports | 39 | — |
| LCD Segments (max) | Up to 296 | — |
| LCD Charge Pump | Integrated, up to 7x bias | — |
| ADC | Integrated (peripheral count/configuration per datasheet) | — |
| Timers | MTIM, FTM (per datasheet) | — |
| Communication Peripherals | SCI, SPI, I2C | — |
| Debug Interface | On-chip ICE, BDM, JTAG boundary scan | Background debugging system (single-wire BDM) |
| Packhaging | 80-pin LQFP (14x14 mm), 0.5 mm pitch | 8-SOIC |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lifecycle Stage | ACTIVE | — |
| Tindminan RoHS | Compliant | — |
| Automotive Qualified | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maksimum na Taktiko ng Oras | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Volte ng Pagbibigay | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |