S9S08QD2J1MSC vs MC9S08QG4CFFE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S9S08QD2J1MSC sa pamamagitan ng NXP Semiconductors at MC9S08QG4CFFE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP
MC9S08QG4CFFE ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | S9S08QD2J1MSC | MC9S08QG4CFFE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Tapus ng Buhay |
| Core | HCS08 (S08) 8-bit CISC | — |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| Temperature na Operasyon | -40C to +125C (Automotive Grade) | — |
| Number of I/O Pins | 4 | — |
| Packhaging | 8-pin SOIC (SOIC-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | — |
| EEPROM | None (Flash-based) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maksimum na Taktiko ng Oras | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Volte ng Pagbibigay | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Katayuan ng Lifecycle | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |