S9S08QD2J1MSC vs MC9S08QG4CFFE 对比
详细并排对比 S9S08QD2J1MSC 出自 NXP Semiconductors 和 MC9S08QG4CFFE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S08QD2J1MSC | MC9S08QG4CFFE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.89 | $1.10 |
| Core | HCS08 (S08) 8-bit CISC | — |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| 工作温度 | -40C to +125C (Automotive Grade) | — |
| Number of I/O Pins | 4 | — |
| 封装 | 8-pin SOIC (SOIC-8) | 16-QFN-EP (5x5 mm), QFN EP |
| 安装类型 | Surface Mount | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | — |
| EEPROM | None (Flash-based) | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| 最大时钟频率 | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| 电源电压 | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| 生命周期状态 | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| 工作温度范围 | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |