SPC5566MVR132 vs SPC5553MVR132 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng SPC5566MVR132 sa pamamagitan ng NXP Semiconductors at SPC5553MVR132 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
SPC5566MVR132 SPC5566MVR132 - 32-bit MCU, 3MB Flash, 132MHz, Automotive | NXP

SPC5566MVR132 - 32-bit MCU, 3MB Flash, 132MHz, Automotive | NXP

SPC5566MVR132 ✓ Nakahanda
NXP Semiconductors
SPC5553MVR132 SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP

SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP

SPC5553MVR132 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro SPC5566MVR132 SPC5553MVR132
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Core e200z6 Power Architecture 32-bit e200z6 Power Architecture, 32-bit, single-issue
Maximum CPU Frequency 132 MHz —
Program Memory (Flash) 3 MB (3M x 8) 1.5 MB (1.5M x 8)
RAM [DATA_NEEDED: SRAM size in KB] —
Operating Voltage [DATA_NEEDED: VDD core/IO range] —
Temperature na Operasyon -40C to +125C -40 C to +125 C (automotive grade)
Automotive Qualification AEC-Q100 Grade 1 —
Packhaging 416-PBGA (27 x 27 mm) —
Uri ng Pagpapasok Surface Mount Surface Mount
Communication Interfaces FlexCAN, DSPI, eSCI —
Timer Modules eMIOS (enhanced Modular I/O System) —
ADC [DATA_NEEDED: eQADC channel count and resolution] —
FPU Yes (double-precision on e200z6) —
Debug Interface Nexus/JTAG —
Level ng MSL 3 (per JEDEC J-STD-020) —
Tindminan RoHS Compliant (PBGA package) —
Lead-Free Yes —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — MPC55xx Qorivva
CPU Frequency — 132 MHz
RAM Size — 64 KB (64K x 8)
Number of I/O — 220
Packhaging / Kaso — 416-BBGA (27 mm x 27 mm)
Oscillator Type — External
Volte ng Pagbibigay — 1.8 V / 2.5 V / 3.3 V / 5 V (mixed I/O)
Packaging — Tray
Connectivity — 2x CAN 2.0B, 2x FlexRay, SPI, SCI, I2C
Peripherals — eTPU, eDMA, 12-bit SAR ADC, EBI

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